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this is information on a product in full production. november 2016 docid029312 rev 4 1/22 STSPIN230 low voltage triple half-bridge motor driver for bldc motors datasheet - production data features ? operating voltage from 1.8 to 10 v ? maximum output current 1.3 a rms ? r ds(on) hs + ls = 0.4 ? typ. ? full protection set ? non-dissipative overcurrent protection ? short-circuit protection ? thermal shutdown ? interlocking function ? energy saving and long battery life with standby consumption less than 80 na applications ? battery-powered 3-phase brushless (bldc) motors in applications such as: ?toys ? robotics ? portable medical equipment description the STSPIN230 device integrates a triple half- bridge low r ds(on) power stage in a small qfn - 3 x 3 mm package. the device is designed to operate in battery- powered scenarios and can be forced into a zero- consumption state, allowing a significant increase in battery life. the device offers a complete set of protection including overcurrent, overtemperature and short- circuit protection. qfn 3x3 (16-pin) www.st.com
contents STSPIN230 2/22 docid029312 rev 4 contents 1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 esd protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1 standby and power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 motor driving . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 overcurrent and short-circuit protection . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.4 thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7 graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.1 vfqfpn 3x3x1.0 16l package information . . . . . . . . . . . . . . . . . . . . . . . 19 9 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
docid029312 rev 4 3/22 STSPIN230 list of tables 22 list of tables table 1. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 2. recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. esd protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 6. pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 7. typical application values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 8. inxh and inxl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 9. vfqfpn 3x3x1.0 16l package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 10. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 11. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
list of figures STSPIN230 4/22 docid029312 rev 4 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 3. typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 4. overcurrent and short-circuit protections management . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 5. disable time versus r en and c en values (v dd = 3.3 v) . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 6. disable time versus r en and c en values (v dd = 1.8 v) . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 7. thermal shutdown management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 8. power stage resistance versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 9. power stage resistance versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 10. overcurrent threshold versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 11. vfqfpn 3x3x1.0 16l package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 12. vfqfpn 3x3x1.0 16l recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
docid029312 rev 4 5/22 STSPIN230 block diagram 22 1 block diagram figure 1. block diagram $09 9 uhohdvh &rqwuroorjlf 96 29 7 96 *1' 67%< (1?)$8/7 ,18+ ,18/ ,19+ ,19/ ,1:+ ,1:/ 2&?6& 2&?6& 2&?6& 96 2879 6(16(8 287: 6(16(9: 2878 9%$7
electrical data STSPIN230 6/22 docid029312 rev 4 2 electrical data 2.1 absolute maximum ratings 2.2 recommended operating conditions 2.3 thermal data table 1. absolute maximum ratings symbol parameter test condition value unit v s supply voltage -0.3 to 11 v v in logic input voltage -0.3 to 5.5 v v out - v sense output to sense voltage drop up to 12 v v s - v out supply to output voltage drop up to 12 v v sense sense pins voltage -1 to 1 v i out,rms continuous power stage output current (each bridge) 1.3 a rms t j,op operative junction temperature -40 to 150 c t j,stg storage junction temperature -55 to 150 c table 2. recommended operating conditions symbol parameter test condition min. typ. max. unit v s supply voltage 1.8 10 v v in logic input voltage 0 5 v t inw logic inputs positive/negative pulse width 300 ns table 3. thermal data symbol parameter conditions value unit r thja junction to ambient thermal resistance natural convection, according to jesd51-2a (1) 1. simulated on a 21.2 x 21.2 mm board, 2s2p 1 oz copper and four 300 ? m vias below exposed pad. 57.1 c/w r thjctop junction to case thermal resistance (top side) simulation with cold plate on package top 67.3 c/w r thjcbot junction to case thermal resistance (bottom side) simulation with cold plate on exposed pad 9.1 c/w r thjb junction to board thermal resistance according to jesd51-8 (1) 23.3 c/w ? jt junction to top characterization according to jesd51-2a (1) 3.3 c/w ? jb junction to board characterization according to jesd51-2a (1) 22.6 c/w
docid029312 rev 4 7/22 STSPIN230 electrical data 22 2.4 esd protection ratings table 4. esd protection ratings symbol parameter test condition class value unit hbm human body model conforming to ansi/esda/jedec js-001-2014 22kv cdm charge device model conforming to ansi/esda/jedec js-002-2014 c2 750 v
electrical characteristics STSPIN230 8/22 docid029312 rev 4 3 electrical characteristics testing conditions: v s = 5 v, t j = 25 c unless otherwise specified. table 5. electrical characteristics symbol parameter test condition min. typ. max. unit supply v sth(on) v s turn-on voltage v s rising from 0 v 1.45 1.65 1.79 v v sth(off) v s turn-off voltage v s falling from 5 v 1.3 1.45 1.65 v v sth(hys) v s hysteresis voltage 180 mv i s v s supply current no commutations, en = 0 900 1300 ? a no commutations, en = 1 1500 1950 ? a i s,stby v s standby current stby = 0 v 10 80 na v stbyl standby low logic level input voltage 0.9 v v stbyh standby high logic level input voltage 1.48 v power stage r ds(on)hs+ls total on resistance hs + ls v s = 10 v, i out = 1.3 a 0.4 0.65 ? v s = 10 v, i out = 1.3 a, t j = 125 c (1) 0.53 0.87 v s = 3 v, i out = 0.4 a 0.53 0.8 i dss leakage current outx = v s 1 ? a outx = gnd - 1 v df freewheeling diode forward voltage i d = 1.3 a 0.9 v t rise rise time v s = 10 v; unloaded outputs 10 ns t fall fall time v s = 10 v; unloaded outputs 10 ns t dt integrated dead time 50 ns logic ios v ih high logic level input voltage 1.6 v v il low logic level input voltage 0.6 v v release fault open drain release voltage 0.4 v v ol en low logic level output voltage i en = 4 ma 0.4 v r stby stby pull-down resistance 36 k ? i pden en pull-down current 10.5 a t end en input propagation delay from en falling edge to out high impedance 55 ns
docid029312 rev 4 9/22 STSPIN230 electrical characteristics 22 t in,d(on) turn-on propagation delay from inxh rising edge to 10% of outx 125 ns t in,d(off) turn-off propagation delay from inxl rising edge to 90% of outx 140 ns protections t jsd thermal shutdown threshold 160 c t jsd,hyst thermal shutdown hysteresis 40 c i oc overcurrent threshold see figure 10 on page 18 .2a 1. based on characterization data on a limited number of samples, not tested during production. table 5. electrical ch aracteristics (continued) symbol parameter test condition min. typ. max. unit
pin description STSPIN230 10/22 docid029312 rev 4 4 pin description figure 2. pin connection (top view) 1. the exposed pad must be connected to ground. table 6. pin description no. name type function 1 inul logic input output u driving input (low side) 2 inuh logic input output u driving input (high side) 3 outu power output power bridge output u 5nc 6 vs supply device supply voltage 7, epad gnd ground device ground 8 outv power output power bridge output v 10 outw power output power bridge output w 11 inwl logic input output w driving input (low side) 12 inwh logic input output w driving input (high side) 13 en\fault logic input\ open drain output logic input 5 v compliant with open drain output. this is the power stage enable (when low, the power stage is turned off) and is forced low through the integrated open-drain mosfet when a failure occurs. ,18/ ,18+ 2878 6(16(8 ,1 :+ ,1:/ 287: 6(16(9: 1& 96 2879 *1' (3$' ,19+ ,19/ (1?)$8/7 67%<? 5(6(7 $09
docid029312 rev 4 11/22 STSPIN230 pin description 22 4 senseu power output sense output bridge u (must be connected to sensevw). 9 sensevw power output sense output bridge v and w (must be connected to senseu). 14 stby\reset logic input logic input 5 v compliant. when forced low, the device is forced into the low consumption mode. 15 invl logic input output v driving input (low side). 16 invh logic input output v driving input (high side). table 6. pin description (continued) no. name type function
typical applications STSPIN230 12/22 docid029312 rev 4 5 typical applications figure 3. typical application schematic table 7. typical application values name value c s 2.2 f / 16 v c spol 22 f / 16 v r sns 330 m ? / 1 w c en 10 nf / 6.3 v r en 18 k ? c stby 1 nf / 6.3 v r stby 18 k ? ".7 4541*/ 74 45#: &/='"6 -5 */6) */6- */7) */7- (/% 0656 06 57 06 58 4&/4&6 4&/4&7 8 3 4/4 7 4 7 %% */8) */8- $ 410- $ 4 $ 45 #: $ &/ 3 45#: 3 &/
docid029312 rev 4 13/22 STSPIN230 functional description 22 6 functional description the STSPIN230 device is a protected triple half-bridge motor driver. 6.1 standby and power-up the device provides a low consumption mode which is set forcing the stby\reset input below the v stbyl threshold. when the device is in standby status the power stage is disabled (outputs are in high impedance) and the supply to the integrated control circuitry is cut off. when the device leaves the standby status, all the control circuitry is reset to power-up condition. 6.2 motor driving the outputs of the three half-bridges are direct ly driven through the logic inputs as listed in table 8 . table 8. inxh and inxl en\fault inxh inxl 'x' half-bridge condition 0 x x high impedance 1 0 0 high impedance 1 0 1 low side mosfet on 1 1 0 high side mosfet on 1 1 1 high impedance (interlocking)
functional description STSPIN230 14/22 docid029312 rev 4 6.3 overcurrent and sh ort-circuit protection the device embeds circuitry protecting each power output against the overload and short- circuit conditions (short to ground, short to vs and short between outputs). when the overcurrent or the short-circuit protec tion is triggered the power stage is disabled and the en\fault input is forced low through the integrated open-drain mosfet discharging the external c en capacitor (refer to figure 4 ). the power stage is kept disabled and the o pen-drain mosfet is kept on until the en\fault input falls below the v release threshold, then the c en capacitor is charged through the r en resistor. figure 4. overcurrent and short-circuit protections management the total disable time after an overcurrent event can be set by properly sizing the external network connected to the en\fault pin (refer to figure 4 ): equation 1 t dis = t discharge + t charge but t charge is normally much higher than t discharge , thus we can consider only the second one contribution: equation 2 where v dd is the pull-up voltage of the r en resistor. 7 &/ '" 6 -5 7 *) 7 3&-&"4& 7 *- &/"#-&% %*4"#-&% &/"#-&% u 0$4% u 7 3&-&"4& &/='"6-5 '" 6-5@ .$6 .$6 %&7*$& &/@.$6 3&-&"4& &/ 0$=4$ 5)4% '" 6 -5 $ &/ * 1%&/ 3 &/ ". 0wfsdvssfou qspufdujpo 1pxfs tubhf u %*4 u $)"3(& %*4$)"3(&
docid029312 rev 4 15/22 STSPIN230 functional description 22 figure 5. disable time versus r en and c en values (v dd = 3.3 v) figure 6. disable time versus r en and c en values (v dd = 1.8 v) %jtbcmfujnf<?t> $ &/ <o'> 3 &/ 3 &/ 3 &/ 3 &/ 3 &/ 3 &/ ". %jtbcmfujnf<?t> $ &/ <o'> 3 &/ 3 &/ 3 &/ 3 &/ 3 &/ 3 &/ ".
functional description STSPIN230 16/22 docid029312 rev 4 6.4 thermal shutdown the device embeds circuitry protecting it from the overtemperature condition. when the thermal shutdown temperature is re ached the power stage is disabled and the en\fault input is forced low through the integrated open-drain mosfet (refer to figure 7 ). the protection and the en\fault output are released when the ic temperature returns below a safe operating value (t jsd - t jsd,hyst ). figure 7. thermal shutdown management 7 &/ '" 6 -5 7 *) 7 3&-&"4& 7 *- 5 k 5 k4% 5 k4% iztu 7 3&-&"4& &/='"6-5 '"6-5@.$6 .$6 %&7*$& &/@.$6 3&-&"4& &/ 0$=4$ 5)4% '" 6 -5 $ &/ 3 &/ u 5)4% * 1%&/ ". 5ifsnbm tivuepxo 1pxfs tubhf &/"#-&% %*4"#-&% %*4"#-&% &/"#-&%
docid029312 rev 4 17/22 STSPIN230 graphs 22 7 graphs figure 8. power stage resistance versus supply voltage figure 9. power stage resistance versus temperature 3 %4 0/
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graphs STSPIN230 18/22 docid029312 rev 4 figure 10. overcurrent threshold versus supply voltage *0$%uisftipme<"> 7 4 <7> ".
docid029312 rev 4 19/22 STSPIN230 package information 22 8 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack specifications, grade definitions a nd product status are available at: www.st.com . ecopack is an st trademark. 8.1 vfqfpn 3x3x1.0 16l package information figure 11. vfqfpn 3x3x1.0 16l package outline
package information STSPIN230 20/22 docid029312 rev 4 figure 12. vfqfpn 3x3x1.0 16l recommended footprint table 9. vfqfpn 3x3x1.0 16l package mechanical data symbol dimensions (mm) notes min. typ. max. a 0.80 0.90 1.00 (1) 1. vfqfpn stands for ?thermally enhanced very th in fine pitch quad packages no lead?. very thin: 0.80 < a 1.00 mm / fine pitch: e < 1.00 mm. the pin #1 identifier must be present on the top surfac e of the package by using an indentation mark or an other feature of the package body. a1 0.02 a3 0.20 b 0.18 0.25 0.30 d 2.85 3.00 3.15 d2 1.70 1.80 1.90 e 2.85 3.00 3.15 e2 1.70 1.80 1.90 e0.50 l 0.45 0.50 0.55
docid029312 rev 4 21/22 STSPIN230 ordering information 22 9 ordering information 10 revision history table 10. device summary order code package packaging STSPIN230 vfqfpn 3x3x1.0 16l tape and reel table 11. document revision history date revision changes 06-may-2016 1 initial release. 30-jun-2016 2 updated document status to datasheet - production data on page 1. updated table 1 on page 6 (changed max. value of v s from 12 to 11). 19-oct-2016 3 updated main title on page 1 (added ?for bldc motors?). updated section : features on page 1 (added ?interlocking function?). updated figure 1 on page 5 , figure 3 on page 12 , and figure 8 on page 17 (replaced by new figures). updated table 3 on page 6 (replaced by new table). updated figure 2 on page 10 (replaced ?sense? by ?senseu? and ?sensevw?). updated table 6 on page 10 (updated pin 4 and 9). minor modifications throughout document. 04-nov-2016 4 updated table 2 on page 6 (added t inw symbol).
STSPIN230 22/22 docid029312 rev 4 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2016 stmicroelectronics ? all rights reserved

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